IIC EEPROM

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Puya designs & offers industrial level series, ultra-high reliability series and automotive series IIC EEPROM, with the densities ranging from 2Kb to 1024Kb. Based on the excellent quality and outstanding customer service, Puya IIC EEPROM product line has been approved by numerous electronics customers.


Features

 Up to 4M cycling and 200 year data retention
 6000V HBM /  200mA 125C Latch-up capability
 0.5uA standby current / 1.5mA program current
 3ms write time/  1.7V 1MHz bus frequency
 Safety protection for  power  on-off / Anti-noise IO design
 ID page for customer encryption
 100% room temperature and high temperature CP
 Full series SOP/TSSOP/UDFN support / 2K-256K SOT23 support
 Known Good Die (KGD) support
 Wafer-Level Chip Scale Package (WLCSP) support


Industrial Level Series

  • 2Kb
  • 4Kb
  • 8Kb
  • 16Kb
  • 32Kb
  • 64Kb
  • 128Kb
  • 256Kb
  • 512Kb
  • 1Mb
      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C02C-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    O

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN / MSOP8 8-lead

  • P24C02A-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    -

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C04C-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    O

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN / MSOP8 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C08C-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    O

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN / MSOP8 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C16C-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    O

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN / MSOP8 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C32C-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    O

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN / MSOP8 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C64C-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    O

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C128D-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    O

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C256B-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    -

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C512B-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    -

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24CM01B-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    100Y

    -

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead

Ultra-high Reliability Serials

  • 128Kb
  • 256Kb
  • 512Kb
      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C128-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    200Y

    -

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C256-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    200Y

    -

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C512-MI

    1MHz

    1.7~5.5V

    -40~85℃

    /

    200Y

    -

    Mass Production

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead

Automotive Level Series

  • 128Kb
  • 256Kb
  • 512Kb
      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C128B-NK

    1MHz

    1.8~5.5V

    -40~105℃

    /

    100Y

    -

    Sampling

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead / SOT23 5 PIN /
    TSOT23 5 PIN

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C256B-NK

    1MHz

    1.8~5.5V

    -40~105℃

    /

    100Y

    -

    Sampling

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead

      Part No. Max CLK Vcc Temp. I/O Bus Data
      Retention
      UID Status Package Datasheet
  • P24C512B-NK

    1MHz

    1.8~5.5V

    -40~105℃

    /

    100Y

    -

    Sampling

    SOP 150mil / TSSOP 8-lead /
    DFN(2X3) / UDFN(2X3) /
    DIP 8-lead


Related Products

Known Good Die(KGD)

Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....

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Wafer-Level Chip Scale Package(WLCSP)

Wafer-Level Chip Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options. The die size of Puya products has leading competitiveness, so Puya WLCSP is a true chip-scale package. Puya provides WLCSP SPI NOR.....

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